ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,472,731, issued on Nov. 18, was assigned to TE CONNECTIVITY SOLUTIONS GmbH (Schaffhausen, Switzerland).
"Thermoset sealant film" was invented by Hyo Chang (Chris) Yun (Fremont, Calif.) and Lei Wang (Fremont, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A thermoset sealant film includes an epoxy and a hardener. The hardener is integrated with the epoxy and remains physically distinct from the epoxy in a formed state of the thermoset sealant film."
The patent was filed on Aug. 19, 2021, under Application No. 17/406,184.
*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=P...