US Patent Issued to TE Connectivity Solutions on June 3 for "Circuit board wafer with contacts mounted on castellated edges" (Pennsylvania Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,887, issued on June 3, was assigned to TE Connectivity Solutions GmbH (Switzerland).

"Circuit board wafer with contacts mounted on castellated edges" was invented by Charles Raymond Gingrich III (Mechanicsburg, Pa.), Keith Edwin Miller (Manheim, Pa.), Scott Eric Walton (Mount Joy, Pa.) and Tim Robert Chevalier (Cleona, Pa.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate assembly includes a first substrate having a first surface and an oppositely facing second surface. Signal pathways are provided on the first surface. The signal pathways extend to first openings which extend inward from an edge of the substrate. First ground pathways are p...