US Patent Issued to TE CONNECTIVITY SOLUTIONS on July 8 for "Layered plating stack for improved contact resistance in corrosive environments" (American, Singaporean Inventors)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,351,936, issued on July 8, was assigned to TE CONNECTIVITY SOLUTIONS GMBH (Schaffhausen, Switzerland).

"Layered plating stack for improved contact resistance in corrosive environments" was invented by Suvrat Bhargava (Baltimore), Matthew Little (Harrisburg, Pa.), Martin William Bayes (Hopkinton, Mass.), Rodney Ivan Martens (Singapore) and Bradley M. Schultz (Mechanicsburg, Pa.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A layered plating stack which includes an underlying plating layer formed on a substrate; an intermediate plating layer; an outer plating layer; and at least one strike layer of noble metal. The noble metal of the strike layer is a dif...