US Patent Issued to TE CONNECTIVITY SOLUTIONS on Aug. 5 for "Electrical shielding for wafer assembly of electrical connector assembly" (Pennsylvania Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,381,360, issued on Aug. 5, was assigned to TE CONNECTIVITY SOLUTIONS GmbH (Schaffhausen, Switzerland).

"Electrical shielding for wafer assembly of electrical connector assembly" was invented by Michael Streckewald (Harrisburg, Pa.) and Julia Anne Lachman (York, Pa.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electrical connector assembly includes a housing having a mating interface configured to be mated with a mating electrical connector assembly. Wafer assemblies are received in a cavity of the housing arranged in a wafer stack. Each wafer assembly includes a leadframe, a wafer body holding the leadframe, cables coupled to the leadframe, a ground...