ALEXANDRIA, Va., June 16 -- United States Patent no. 12,306,030, issued on May 20, was assigned to TE Connectivity Solutions GmbH (Schaffhausen, Switzerland) and Tyco Electronics (Shanghai) Co. Ltd. (Shanghai).
"Sensor assembly" was invented by Pai Rajendra (Shanghai), Tian Xia (Shanghai), Lei Pan (Shanghai) and Stephen Descioli (Louisville, Ky.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A sensor assembly includes a housing including a cavity allowing a liquid to flow thereinto, a liquid level sensing module installed on the housing and configured to sense information related to a liquid level when the liquid is flowing into the cavity, and a turbidity sensing module installed on the housing. The turbidi...