US Patent Issued to TE Connectivity Solutions, Tyco Electronics (Shanghai), Tyco Electronics AMP Qingdao on April 8 for "Back plate and electronic device" (Chinese, American Inventors)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,274,019, issued on April 8, was assigned to TE Connectivity Solutions GmbH (Schaffhausen, Switzerland), Tyco Electronics (Shanghai) Co. Ltd (Shanghai) and Tyco Electronics AMP Qingdao Ltd. (Qingdao, China).

"Back plate and electronic device" was invented by Jinqiang (Jeff) Wang (Qingdao, China), Zhiqiang (Simon) Li (Shanghai), Guoxiao (Neo) Shen (Shanghai), Jiefeng (Lear) Zhang (Shanghai) and Brian Patrick Costello (Scotts Valley, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A back plate configured to support a circuit board includes a body. The body defines a central recess formed into a top surface thereof, and a raised main support column ex...