US Patent Issued to TE Connectivity Solutions, TE Connectivity Belgium, Tyco Electronics Holdings (Bermuda) No. 7 on Dec. 30 for "Impedance matching structure for a high-speed connector and connector" (Belgian, American, Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,625, issued on Dec. 30, was assigned to TE Connectivity Solutions GmbH (Schaffhausen, Switzerland), TE Connectivity Belgium BV (Hamilton, Bermuda) and Tyco Electronics Holdings (Bermuda) No. 7 Ltd. (Oostkamp, Belgium).

"Impedance matching structure for a high-speed connector and connector" was invented by Lieven Decrock (Oostkamp, Belgium), Michael Rosier (Middletown, Pa.) and Josh Jiang (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An impedance matching structure for a high-speed connector includes a pair of ground leads, a differential pair of signal leads, a ground plane, a first region in which the ground leads and the different...