US Patent Issued to TDK on Oct. 7 for "Method of producing assembly of stacked elements having resin layer with fillers" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,008, issued on Oct. 7, was assigned to TDK Corp. (Tokyo).

"Method of producing assembly of stacked elements having resin layer with fillers" was invented by Yongfu Cai (Tokyo) and Shuhei Miyazaki (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an assembly in which a space between two elements is filled with a filler containing resin, a configuration that can limit both the size of the assembly and the cost of the fillers is provided. An assembly of stacked elements has: first element having first surface; resin layer that is arranged on first surface and that contains a plurality of fillers; and second element that is arranged on resin layer...