ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,454,032, issued on Oct. 28, was assigned to TDK Corp. (Tokyo).
"Substrate processing apparatus" was invented by Yohei Sato (Tokyo), Hiroshi Koizumi (Tokyo), Osamu Shindo (Tokyo), Mitsuyoshi Makida (Tokyo) and Masashi Matsumoto (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus including a lower jig plate for arranging a substrate which is an object to be pressurized, columnar members supporting the lower jig plate, and a heat dissipating column contacting the lower jig plate directly or indirectly and having a higher heat dissipation property than the columnar members."
The patent was filed on May 25, 2023, under App...