US Patent Issued to TDK on May 13 for "Multi-layer coil component" (Japanese Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,423, issued on May 13, was assigned to TDK Corp. (Tokyo).

"Multi-layer coil component" was invented by Akihiko Oide (Tokyo), Makoto Yoshino (Tokyo), Tomoki Okada (Yurihonjo, Japan), Hideki Saitou (Yurihonjo, Japan), Seiji Osada (Yurihonjo, Japan), Kazuhiro Ebina (Tokyo), Kunio Oda (Tokyo), Takashi Abe (Yurihonjo, Japan), Akio Shibata (Tokyo) and Kazuo Iwai (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "In the multi-layer coil component, the via conductor electrically connecting the coil layers adjacent to each other in the stacking direction of the element body protrudes from the coil region toward the side surface of the element body when vi...