US Patent Issued to TDK on March 4 for "Electronic component embedded substrate and circuit module using the same" (Japanese Inventors)

ALEXANDRIA, Va., March 5 -- United States Patent no. 12,243,841, issued on March 4, was assigned to TDK Corp. (Tokyo).

"Electronic component embedded substrate and circuit module using the same" was invented by Toshiyuki Abe (Tokyo), Yoshihiro Suzuki (Tokyo), Hironori Chiba (Tokyo), Tetsuya Yazaki (Tokyo) and Hiroshige Ohkawa (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "To improve heat dissipation efficiency in an electronic component embedded substrate for mounting an electronic component of a type being prohibited from connecting to a ground pattern. An electronic component embedded substrate includes an electronic component and a heat transfer block which are embedded in insulating layers, a wiri...