US Patent Issued to TDK on July 22 for "Thin film capacitor and electronic circuit substrate having the same" (Japanese Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,369,337, issued on July 22, was assigned to TDK Corp. (Tokyo).

"Thin film capacitor and electronic circuit substrate having the same" was invented by Daiki Ishii (Tokyo), Yoshihiko Yano (Tokyo), Kenichi Yoshida (Tokyo), Tetsuhiro Takahashi (Tokyo) and Yuki Yamashita (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "To provide a thin film capacitor in which peeling-off of an electrode layer is less likely to occur. A thin film capacitor includes a metal foil having a roughened upper surface, a dielectric film covering the upper surface of the metal foil and having an opening for partly exposing the metal foil therethrough, a first electrode layer con...