ALEXANDRIA, Va., July 23 -- United States Patent no. 12,369,258, issued on July 22, was assigned to TDK Corp. (Tokyo).
"Electronic circuit module" was invented by Shuichi Takizawa (Tokyo), Atsushi Yoshino (Tokyo), Yuki Okino (Tokyo) and Hiromu Harada (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein is an electronic circuit module that includes a circuit board, an electronic component mounted on an upper surface of the circuit board, and a mold member that covers the upper and side surfaces of the circuit board. The lower area of the side surface of the circuit board is exposed so as not to be covered with the mold member."
The patent was filed on June 23, 2023, under Application No. 18...