US Patent Issued to TDK on July 15 for "Photosensitive conductive paste, laminated electronic component, and method of manufacturing laminated electronic component" (Japanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,362,078, issued on July 15, was assigned to TDK Corp. (Tokyo).

"Photosensitive conductive paste, laminated electronic component, and method of manufacturing laminated electronic component" was invented by Yuya Ishima (Tokyo), Masaki Takahashi (Tokyo), Akira Suda (Tokyo), Takashi Suzuki (Tokyo) and Hidenobu Umeda (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "In a photosensitive conductive paste containing photosensitive organic components, conductor powder, and quartz powder, melting of the quartz powder does not occur or is very unlikely to occur in a heat treatment step, and in the heat treatment step, it functions sufficiently to bring shrinka...