ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,608, issued on July 1, was assigned to TDK Corp. (Tokyo).
"Circuit substrate" was invented by Hanako Yoshino (Tokyo), Keigo Higashida (Tokyo) and Taichi Watanabe (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein is a circuit substrate that includes a coil component mounted on the substrate having first and second land patterns and first and second dummy land patterns. The coil component includes a first signal terminal and a first dummy terminal which are provided on the first flange part, a second signal terminal and a second dummy terminal which are provided on the second flange part, and a wire wound around the winding core pa...