US Patent Issued to TDK on Jan. 20 for "Electronic component having terminal formation area offset from mounting surface center and manufacturing method of same and of mounting board" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,768, issued on Jan. 20, was assigned to TDK Corp. (Tokyo).

"Electronic component having terminal formation area offset from mounting surface center and manufacturing method of same and of mounting board" was invented by Atsushi Yoshino (Tokyo), Shuichi Takizawa (Tokyo), Yuki Okino (Tokyo) and Hiromu Harada (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed herein is an electronic component that includes a mounting surface having a terminal formation area and a plurality of terminal electrodes arranged in an array in the terminal formation area. The center point of the terminal formation area is offset with respect to the center point of...