US Patent Issued to TDK on Feb. 10 for "Thin film capacitor using metal foil and electronic circuit substrate having the same" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,548,716, issued on Feb. 10, was assigned to TDK Corp. (Tokyo).

"Thin film capacitor using metal foil and electronic circuit substrate having the same" was invented by Daiki Ishii (Tokyo), Yoshihiko Yano (Tokyo), Yuki Yamashita (Tokyo), Kenichi Yoshida (Tokyo) and Tetsuhiro Takahashi (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "To provide a thin film capacitor having high adhesion performance with respect to a circuit substrate. A thin film capacitor includes: a metal foil having a roughened upper surface; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a first ...