US Patent Issued to TDK on Aug. 26 for "Electronic component package" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,922, issued on Aug. 26, was assigned to TDK Corp. (Tokyo).

"Electronic component package" was invented by Yongfu Cai (Tokyo), Shuhei Miyazaki (Tokyo) and Kazuma Yamawaki (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic component package of an embodiment of the disclosure includes a base, a first plated layer, a first electronic component chip, a second plated layer, and a second electronic component chip. The base includes a first surface and a second surface. The first plated layer covers the first surface. The first electronic component chip is provided on the first plated layer with a first insulating layer being interposed the...