US Patent Issued to TDK on April 8 for "Microelectromechanical microphone with membrane trench reinforcements and method of fabrication" (Danish, Japanese Inventors)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,269,734, issued on April 8, was assigned to TDK Corp. (Tokyo).

"Microelectromechanical microphone with membrane trench reinforcements and method of fabrication" was invented by Pirmin Rombach (Kongens Lyngby, Denmark), Kurt Rasmussen (Herlev, Denmark), Dennis Mortensen (Bagsvard, Denmark), Cheng-Yen Liu (Soborg, Denmark), Morten Ginnerup (Kongens Lyngby, Denmark), Jan Ravnkilde (Hedehusene, Denmark) and Jotaro Akiyama (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A microelectromechanical (MEMS) microphone with membrane trench reinforcements and method of fabrication is provided. The MEMS microphone includes a flexible plate and a rigid plate mec...