US Patent Issued to TCL ZHONGHUAN RENEWABLE ENERGY TECHNOLOGY on Dec. 2 for "Black wheels for transporting ultra-thin silicon wafer" (Chinese Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,008, issued on Dec. 2, was assigned to TCL ZHONGHUAN RENEWABLE ENERGY TECHNOLOGY Co. LTD. (Tianjin, China).

"Black wheels for transporting ultra-thin silicon wafer" was invented by Muren Bao (Tianjin, China) and Feiyang Li (Tianjin, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A black wheel for transporting an ultra-thin silicon wafer may include grooves provided on a side surface of the black wheel along a circumferential direction of the black wheel. Compressed air lines are respectively accommodated within the grooves, and an air outlet of each of the compressed air lines is provided to align with a side of the ultra-thin silicon wafer clo...