ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,230,742, issued on Feb. 18, was assigned to TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY Co. LTD. (Shenzhen, China).
"Substrate and method of manufacturing thereof" was invented by Weiwei Liu (Shenzhen, China).
According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate and a method of manufacturing thereof. A scratch-resistant layer is formed before filling the solder paste in the area corresponding to the binding terminal of the light-emitting device on the substrate, so that each circuit in the drive circuit area of the substrate will not be damaged during screen printing. After filling solder paste, the scratch-resistant layer is stripped off to prevent t...