ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,232,306, issued on Feb. 18, was assigned to TATSUTA ELECTRIC WIRE & CABLE Co. LTD. (Higashiosaka, Japan).
"Electromagnetic wave shielding film and shielded printed wiring board" was invented by Takahiko Katsuki (Kizugawa, Japan), Hiroshi Tajima (Kizugawa, Japan) and Sirou Yamauchi (Kizugawa, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electromagnetic wave shielding film has permeability to volatile components, shielding characteristics, and resistance to folding. The electromagnetic wave shielding film includes an adhesive layer; a metal layer made of a metal and placed on the adhesive layer; and an insulating layer placed on the metal layer...