US Patent Issued to TANAZAWA HAKKOSHA on June 10 for "Printed wiring board and method for manufacturing printed wiring board" (Japanese Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,328,814, issued on June 10, was assigned to TANAZAWA HAKKOSHA Co. LTD. (Higashiosaka, Japan).

"Printed wiring board and method for manufacturing printed wiring board" was invented by Keiichiro Yamamoto (Higashiosaka, Japan), Kazuo Tani (Higashiosaka, Japan) and Masaharu Yano (Higashiosaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A printed wiring board having a sheet material including a cloth-like material woven of reinforced fiber. An angle between a warp thread and a weft thread of the reinforced fiber of the sheet material is 90 degrees. In the sheet material, threads configuring the cloth-like material are cut so that one side of a circ...