US Patent Issued to TAIYO YUDEN on Oct. 28 for "Acoustic wave device and wafer with support substrate having an uneven surface, and manufacturing method of wafer" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,961, issued on Oct. 28, was assigned to TAIYO YUDEN Co. LTD. (Tokyo).

"Acoustic wave device and wafer with support substrate having an uneven surface, and manufacturing method of wafer" was invented by Shinji Yamamoto (Tokyo) and Michio Miura (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "An acoustic wave device includes a support substrate having an uneven surface, a piezoelectric layer provided on the uneven surface of the support substrate, an electrode that excites an acoustic wave in the piezoelectric layer, and an insulating layer that is provided between the uneven surface of the support substrate and the piezoelectric layer, and has a...