ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,618, issued on May 13, was assigned to Taiwna Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Semiconductor device having a heat dissipation structure connected chip package" was invented by Po-Yuan Teng (Hsinchu, Taiwan), Hung-Yi Kuo (Taipei, Taiwan), Hao-Yi Tsai (Hsinchu, Taiwan), Tin-Hao Kuo (Hsinchu, Taiwan), Yu-Chia Lai (Miaoli County, Taiwan) and Shih-Wei Chen (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a first chip package, a heat dissipation structure and an adapter. The first chip package includes a semiconductor die laterally encapsulated by an insulating encapsulant, the semicon...