US Patent Issued to Taiwan Semicondutor Manufacturing on Nov. 18 for "Power delivery structures and methods of manufacturing thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,215, issued on Nov. 18, was assigned to Taiwan Semicondutor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Power delivery structures and methods of manufacturing thereof" was invented by Ting-Yu Yeh (Hsinchu, Taiwan), Han-Hsiang Huang (Hsinchu, Taiwan), Chun-Hsien Wen (Hsinchu, Taiwan) and Chih-Wei Chang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a first connector, a second connector, and a redistribution structure disposed between the first connector and the second connector. The redistribution structure includes a first connection tree electrically connecting the first connector to the second connec...