ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,773, issued on Sept. 9, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Vacuum chuck" was invented by Po-Yu Su (Keelung, Taiwan), Young-Wei Lin (Taoyuan, Taiwan), Yu Liang Huang (Taoyuan, Taiwan), Chia-Ching Lee (Taoyuan, Taiwan), Chi-Chun Peng (Hsinchu County, Taiwan), Chen Liang Chang (New Taipei, Taiwan) and Kuo Hui Chang (Taoyuan County, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "At least one embodiment, a vacuum chuck includes a moisture gate structure that allows for moisture to escape to reduce an amount of warpage in a workpiece when present on the vacuum chuck. The moisture gate structure includes...