US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 9 for "Vacuum assembly for chemical mechanical polishing" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,409,529, issued on Sept. 9, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Vacuum assembly for chemical mechanical polishing" was invented by Yu-Chen Wei (New Taipei, Taiwan), Chih-Yuan Yang (Hsinchu, Taiwan), Shih-Ho Lin (Jhubei, Taiwan), Jen Chieh Lai (Tainan, Taiwan), Szu-Cheng Wang (Tainan, Taiwan) and Chun-Jui Chu (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes depositing a slurry onto a polishing pad of a chemical mechanical polishing (CMP) station. A workpiece is polished and polishing by-products and slurry are removed from the polishing pad by a vacuum head. A CMP apparatus inc...