US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Sept. 9 for "Semiconductor structure with improved heat dissipation" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,804, issued on Sept. 9, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor structure with improved heat dissipation" was invented by Cheng-Chin Lee (Taipei, Taiwan), Shau-Lin Shue (Hsinchu, Taiwan), Shao-Kuan Lee (Kaohsiung, Taiwan), Hsiao-Kang Chang (Hsinchu, Taiwan), Cherng-Shiaw Tsai (New Taipei, Taiwan), Kai-Fang Cheng (Taoyuan, Taiwan), Hsin-Yen Huang (New Taipei, Taiwan), Ming-Hsien Lin (Hsinchu County, Taiwan), Chuan-Pu Chou (Hsinchu County, Taiwan), Hsin-Ping Chen (Hsinchu County, Taiwan), Chia-Tien Wu (Taichung, Taiwan) and Kuang-Wei Yang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark ...