US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 9 for "Semiconductor package and methods of fabricating a semiconductor package" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,846, issued on Sept. 9, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package and methods of fabricating a semiconductor package" was invented by Chin-Liang Chen (Kaohsiung, Taiwan), Hao-Cheng Hou (Hsinchu, Taiwan), Yu-Min Liang (Taoyuan, Taiwan), Jung-Wei Cheng (Hsinchu, Taiwan) and Tsung-Ding Wang (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package provided herein includes a package substrate and a semiconductor device. The package substrate includes a redistribution structure, an interconnect structure bonded to the interconnect structure and an insulation materia...