ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,805, issued on Sept. 9, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Semiconductor package" was invented by Chen-Hsiang Lao (New Taipei, Taiwan), Yuan-Sheng Chiu (Miaoli, Taiwan), Hung-Chi Li (Taipei, Taiwan), Shih-Chang Ku (Taipei, Taiwan) and Tsung-Shu Lin (New Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first heat dissipation plate, a second heat dissipation plate, a plurality of heat generating assemblies, and a plurality of fixture components. The first heat dissipation plate has a first upper surface and a first lower surface. The first heat dissipation pl...