US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 9 for "Semiconductor device and method of manufacture" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,851, issued on Sept. 9, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor device and method of manufacture" was invented by Po-Hao Tsai (Zhongli, Taiwan), Po-Yao Chuang (Hsinchu, Taiwan), Ming-Chih Yew (Hsinchu, Taiwan) and Shin-Puu Jeng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A device includes a redistribution structure, a first semiconductor device, a first antenna, and a first conductive pillar on the redistribution structure that are electrically connected to the redistribution structure, an antenna structure over the first semiconductor device, wherein the antenna structure in...