ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,414,355, issued on Sept. 9, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor device and manufacturing method thereof" was invented by Ta-Chun Lin (Hsinchu, Taiwan), Ming-Che Chen (Hsinchu, Taiwan), Jyun-Yang Shen (Kaohsiung, Taiwan), Yu-Chang Liang (Kaohsiung, Taiwan), Chun-Jun Lin (Hsinchu, Taiwan), Kuo-Hua Pan (Hsinchu, Taiwan) and Jhon Jhy Liaw (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a semiconductor device is provided. The method includes forming first and second semiconductor fins; forming first and second gate structures respectively over fir...