US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 9 for "Polymer layers embedded with metal pads for heat dissipation" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,852, issued on Sept. 9, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsin-Chu, Taiwan).

"Polymer layers embedded with metal pads for heat dissipation" was invented by Hao-Hsiang Chuang (Taipei, Taiwan), Shih-Wei Liang (Dajia Township, Taiwan), Ching-Feng Yang (Taipei, Taiwan), Kai-Chiang Wu (Hsinchu, Taiwan), Hao-Yi Tsai (Hsinchu, Taiwan), Chuei-Tang Wang (Taichung, Taiwan) and Chen-Hua Yu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit structure includes a metal pad, a passivation layer including a portion over the metal pad, a first polymer layer over the passivation layer, and a first Post-Pa...