US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 9 for "Package structure and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,856, issued on Sept. 9, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, China).

"Package structure and method of manufacturing the same" was invented by Ting-Chen Tseng (Hsinchu, Taiwan), Hung-Jui Kuo (Hsinchu, Taiwan), Yu-Hsiang Hu (Hsinchu, Taiwan) and Sih-Hao Liao (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes a semiconductor die, conductive pillars, an insulating encapsulation, a redistribution circuit structure, and a solder resist layer. The conductive pillars are arranged aside of the semiconductor die. The insulating encapsulation encapsulates the semiconductor die and t...