US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 9 for "Package structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,862, issued on Sept. 9, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Package structure and manufacturing method thereof" was invented by Chi-Yang Yu (Taoyuan, Taiwan), Nien-Fang Wu (Chiayi, Taiwan), Hai-Ming Chen (Kaohsiung, Taiwan), Yu-Min Liang (Taoyuan, Taiwan) and Jiun-Yi Wu (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package and a manufacturing method for the semiconductor package are provided. The semiconductor package includes a redistribution layer, a semiconductor die, conducting connectors, dummy bumps and an underfill. The semiconductor die is disposed on a top surfac...