US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Sept. 9 for "Interconnect structure including topological material" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,837, issued on Sept. 9, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Interconnect structure including topological material" was invented by Meng-Pei Lu (Hsinchu, Taiwan), Shin-Yi Yang (Hsinchu, Taiwan), Cian-Yu Chen (Hsinchu, Taiwan), Yun-Chi Chiang (Hsinchu, Taiwan) and Ming-Han Lee (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a substrate and an interconnect layer disposed over the substrate. The interconnect layer includes an interconnect structure which includes a topological material. The topological material includes a topological insulator, a topological...