US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 9 for "Integrated fan-out package and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,867, issued on Sept. 9, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated fan-out package and manufacturing method thereof" was invented by Jhih-Yu Wang (New Taipei, Taiwan), Hung-Jui Kuo (Hsinchu, Taiwan), Yu-Hsiang Hu (Hsinchu, Taiwan), Sih-Hao Liao (New Taipei, Taiwan) and Yung-Chi Chu (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated fan-out (InFO) package includes a die, an encapsulant laterally encapsulating the die, and a redistribution structure. The redistribution structure is disposed on the encapsulant. The redistribution structure includes a plurality of routing patt...