US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 9 for "Integrated circuit package and method" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,799, issued on Sept. 9, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated circuit package and method" was invented by Chen-Hua Yu (Hsinchu, Taiwan), Wei Ling Chang (Hsinchu, Taiwan), Chuei-Tang Wang (Taichung, Taiwan), Fong-Yuan Chang (Hsinchu, Taiwan) and Chieh-Yen Chen (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an embodiment, a device includes: a processor die including circuit blocks, the circuit blocks including active devices of a first technology node; a power gating die including power semiconductor devices of a second technology node, the second technology node larger than the ...