US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 9 for "Integrated circuit package and method" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,817, issued on Sept. 9, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated circuit package and method" was invented by Chi-Hui Lai (Taichung, Taiwan), Shu-Rong Chun (Zhubei, Taiwan), Kuo Lung Pan (Hsinchu, Taiwan), Tin-Hao Kuo (Hsinchu, Taiwan), Hao-Yi Tsai (Hsinchu, Taiwan), Chung-Shi Liu (Hsinchu, Taiwan) and Chen-Hua Yu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an embodiment, a device includes: a package component including: a first integrated circuit die; an encapsulant at least partially surrounding the first integrated circuit die; a redistribution structure on the encapsulant, ...