US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 9 for "Die attached leveling control by metal stopper bumps" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,863, issued on Sept. 9, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Die attached leveling control by metal stopper bumps" was invented by Wei-Jhih Mao (Taipei, Taiwan), Kuei-Sung Chang (Kaohsiung, Taiwan) and Shang-Ying Tsai (Pingzhen, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In some embodiments, the present disclosure relates to an integrated chip including a substrate and a first die disposed over the substrate. A first plurality of die stopper bumps are disposed along a backside of the first die. The first plurality of die stopper bumps directly contact the backside of the first die, and the first...