US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 9 for "Buffer design for package integration" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,882, issued on Sept. 9, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Buffer design for package integration" was invented by Jie Chen (New Taipei, Taiwan), Hsien-Wei Chen (Hsinchu, Taiwan), Ming-Fa Chen (Taichung, Taiwan) and Chen-Hua Yu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a package includes bonding a device die to an interposer wafer, with the interposer wafer including metal lines and vias, forming a dielectric region to encircle the device die, and forming a through-via to penetrate through the dielectric region. The through-via is electrically connected to the dev...