US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 9 for "Bilayer seal material for air gaps in semiconductor devices" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,779, issued on Sept. 9, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Bilayer seal material for air gaps in semiconductor devices" was invented by Shuen-Shin Liang (Hsinchu County, Taiwan), Chen-Han Wang (Zhubei, Taiwan), Keng-Chu Lin (Chao-Chou Ping-Tung, Taiwan), Tetsuji Ueno (Hsinchu, Taiwan) and Ting-Ting Chen (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a method for forming a semiconductor device includes forming an opening between first and second sidewalls of respective first and second terminals. The first and second sidewalls oppose each other. The me...