US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 30 for "Structure having thermal dissipation structure therein and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,366, issued on Sept. 30, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Structure having thermal dissipation structure therein and manufacturing method thereof" was invented by Chen-Hua Yu (Hsinchu, Taiwan), Yian-Liang Kuo (Hsinchu, Taiwan) and Kuo-Chung Yee (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes a first thermal dissipation structure. The first thermal dissipation structure includes a semiconductor substrate, conductive vias, a thermal transmission structure, first capacitors, bonding pads, and bonding vias. The conductive vias are embedded in the semiconductor s...