US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Sept. 30 for "Semiconductor structure including boundary header cell and method for manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,433,032, issued on Sept. 30, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor structure including boundary header cell and method for manufacturing the same" was invented by Hao-Tien Kan (New Taipei, Taiwan), Yan-Shen You (Taoyuan, Taiwan), Chin-Shen Lin (Taipei, Taiwan), Kuo-Nan Yang (Hsinchu, Taiwan) and Chung-Hsing Wang (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure and a method for manufacturing the semiconductor structure are provided. The semiconductor structure comprises a first semiconductor device, a second semiconductor device, and a first semic...