US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 30 for "Semiconductor packages and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,435, issued on Sept. 30, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor packages and methods of forming the same" was invented by Cheng-Yen Hsieh (Hsinchu, Taiwan), Chun-Hui Yu (Hsinchu County, Taiwan), Ping-Kang Huang (Chiayi, Taiwan), Sao-Ling Chiu (Hsinchu, Taiwan) and Yi-Jhang Wang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first interposer, a second interposer, a first die, a second die and at least one bridge structure. The first interposer and the second interposer are embedded by a first dielectric encapsulation. The first die is disposed ...