ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,432,933, issued on Sept. 30, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).
"Semiconductor packages" was invented by Hsiang-Ku Shen (Hsinchu, Taiwan), Ku-Feng Lin (New Taipei, Taiwan), Liang-Wei Wang (Hsinchu, Taiwan) and Dian-Hau Chen (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first integrated circuit and a second integrated circuit. The first integrated circuit includes a first semiconductor substrate, a first bonding structure bonded to the second integrated circuit, a ferromagnetic layer surrounding the first bonding structure, and a memory cell between the firs...