US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 30 for "Semiconductor package including corner bumps coaxially offset from the pads and non-corner bumps coaxially aligned with the pads" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,452, issued on Sept. 30, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package including corner bumps coaxially offset from the pads and non-corner bumps coaxially aligned with the pads" was invented by Chiang-Jui Chu (Yilan County, Taiwan), Ching-Wen Hsiao (Hsinchu, Taiwan) and Hao-Chun Liu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit has corner regions and non-corner regions between the corner regions and includes a semiconductor substrate, conductive pads, passivation layer, post-passivation layer, first conductive posts, and second conductive posts. The con...