US Patent Issued to Taiwan Semiconductor Manufacturing on Sept. 30 for "Semiconductor package and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,417, issued on Sept. 30, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor package and method of manufacturing the same" was invented by Li-Hsien Huang (Hsinchu County, Taiwan), An-Jhih Su (Taoyuan, Taiwan), Der-Chyang Yeh (Hsin-Chu, Taiwan), Hua-Wei Tseng (New Taipei, Taiwan), Chiang Lin (Hsinchu, Taiwan) and Ming-Shih Yeh (Hsinchu County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a semiconductor die including an active surface and an electrical terminal on the active surface, and a redistribution circuitry disposed on the active surface of the semiconductor d...