US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Sept. 30 for "Semiconductor interconnection structures comprising a resistor device and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,431,426, issued on Sept. 30, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor interconnection structures comprising a resistor device and methods of forming the same" was invented by Kai-Fang Cheng (Taoyuan, Taiwan), Cherng-Shiaw Jacob Tsai (New Taipei, Taiwan), Cheng-Chin Lee (Taipei, Taiwan), Ming-Hsien Lin (Hsinchu, Taiwan) and Hsiao-Kang Chang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An interconnection structure includes a first dielectric layer, a first conductive layer disposed in the first dielectric layer, a second dielectric layer disposed over the first dielectric layer, ...